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Kết quả (Anh) 1:

studying at tdm university

Kết quả (Anh) 2:

I'm going to college.

Kết quả (Anh) 3:

Electroless aluminum is capable of becoming one of the beneficial methods to develop thin films of Al and aluminum wiring at a very low cost. It is very difficult to perform electro deposition of aluminum in aqueous solution because aluminum is not a very noble metal. In spite of being able to deposit Al from a room-temperature ionic liquid,[99] there have been no established techniques well in virtue. A method used for the electroless plating of Al is based on using AlCl3-1-ethyl-3-methylimidazolium chloride (AlCl3-EMIC) ionic liquid as the electrolyte and lithium hydride (LiH) as the solid reducing agent. It is ceded for its bath composition (contained LiH) as it was challenging to control the bath condition and stability. The main reasons for the limited use of LiH-based baths are that LiH solubility in the plating bath is very low and usually supplemented with excessive temperature during the deposition reaction. Recently, the same group has further investigated electroless aluminum plating based on using AlCl3-EMIC ionic liquid with di-isobutyl aluminum hydride (DIBAH) as a liquid reducing agent. The DIBAH-based baths were easier to control and regulate for stability than those containing LiH. However, reports on this topic such as film composition, plating condition, and reaction mechanism are still scarce. If the plating technique is established, it would widen the likelihood of obtaining thin and thick film coatings on the substrates of insulating material and intricate structures without electricity.